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Call for Abstracts for Third Pan-European Electronics Design Conference

04/27/2026 | Global Electronics Association
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Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

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Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

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The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

Cadence, NVIDIA Expand AI & Accelerated Computing Partnership

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