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KYZEN to Offer Complete Cleaning Control at SMTA Guadalajara
August 22, 2022 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The KYZEN team will showcase the newest addition to the award-winning AQUANOX product line: AQUANOX A4626, as well as Process Control and Optimization Technology.
The environmentally friendly AQUANOX A4626 removes the latest polymeric no-clean flux residues while providing superior results on traditional lead-free and eutectic tin-lead residues. It has a long tank life and is safe for multi-pass applications.
KYZEN will also feature the KYZEN Process Control System (PCS), and the KYZEN Analyst from their award-winning process control products.
The KYZEN PCS is the first and only concentration monitoring and control system to monitor and automatically react to the dynamic changes in the wash bath concentration. The process control system features improved control algorithms and a 7” color touchscreen interface.
The KYZEN ANALYST monitors and analyzes wash bath concentration in real-time, to deliver versatile analytical report formats that are easily accessed anytime, anyplace from any device, if so desired. Using direct signal measurement technology for sniper-like precision and accuracy across higher temperature ranges, the KYZEN ANALYST is accurate in more conditions, giving you more options to meet your process needs. Built from the ground up, KYZEN ANALYST meets the industry’s demanding needs for accuracy, reporting, and analytics.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst will complete the optimization and provide you with a worry-free process.
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Julia McCaffrey - NCAB GroupSuggested Items
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.