-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Wistron, Purdue University Signed a Cutting-edge Technology Research Plan
August 22, 2022 | WistronEstimated reading time: 1 minute
Wistron Corporation announced signing a cutting-edge technology research plan with Purdue University. Both will cooperate on open edge computing and smart manufacturing related applications, while jointly developing decentralized processing systems that can be used in smart factory management platforms.
Wistron and Purdue University started cooperation negotiations in 2021. After in-depth discussions on the direction and implementation of the research plan, a consensus was reached in mid-2022, and a master agreement in cooperation was signed afterwards. Wistron and Purdue will formulate substantive research subjects under this framework. Wistron will invest in R&D and talents in the next three years to jointly promote research for the next generation edge computing platform with Purdue University.
Simon Lin, Chairman of Wistron, said: "Wistron always devotes to promoting advanced technology research, and has continuously collaborated with the best global universities, experts, and scholars. This research collaboration with Purdue University shows that Wistron’s continuous growth stems from not only the R&D transformation inside the company but from also working with excellent institutes and talents in and outside Taiwan, making breakthroughs in technologies, accelerating digital transformation, and building technological competitiveness. Through research collaboration, Wistron can expand its reach in the United States, participate in technology alliances, and access the latest information in the industry."
Dr. Mung Chiang (Purdue University President-Elect, formerly John A Edwardson Dean of College of Engineering) is the project director of this cooperation program. He states: " We are excited about the new research collaboration between Purdue and Wistron, one of the largest tech companies in the world on the edge of innovation today. We thank Wistron’s chairman, Simon Lin, for his visionary leadership in making this collaboration a reality. These research projects will accelerate our joint effort in advanced manufacturing, cyber security and edge computing.”
According to Wistron, the results of this research plan will contribute to the development of Wistron's new businesses in the future, and a R&D team will be established by recruiting local professional talents. Furthermore, Wistron will support talents expected to contribute to society as well as technology development by offering scholarships to two or three Taiwanese students studying at Purdue to join the research projects.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).