Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
PDR Rework Systems Announces New Integrated Reball System for Rework
August 24, 2022 | PDR Rework SystemsEstimated reading time: Less than a minute
PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, announced the release of the firm’s new integrated Reballing system for all PDR Evolution Series Rework Systems.
PDR’s latest reball system now incorporates both solder paste application and reball sphere attach in one easy-to-use system, incorporating advanced nano-technology for a clean, high precision reball method for rework.
This PDR exclusive also incorporates a conveniently integrated excess sphere recovery chamber to capture excess spheres that can easily be accessed on the reball platform for later use, or to accelerate the process when re-balling multiple BGA’s concurrently.
When used with PDR’s ThermoActive Suite Software Reballing Mode profiles, the entire process is simple to use, accurate and provides quality reballing results. This saves both time and money, as well as preventing solder sphere loss due to handling errors.
Although made specifically to integrate into PDR Systems, PDR Reball systems can be used as stand-alone devices for any reballing application where highly accurate reball applications are required.
PDR Reball System are made of high-quality materials and are manufactured with new, state-of-the-art laser technology to ensure highly accurate stencil fabrication and ultra-smooth edge/bore finishes.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.