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Trackwise Designs Awarded Cyber Essentials Plus Accreditation
August 25, 2022 | TrackwiseEstimated reading time: Less than a minute

Trackwise is delighted to have been awarded the Cyber Essentials Plus accreditation, the Government’s enhanced cyber security recognition, for the 7th consecutive year.
The Cyber Essentials scheme was launched in 2014 and is designed to help UK businesses protect themselves against the threat of cyber attack. It offers verifiable certification that Trackwise has achieved the more advanced of the two Cyber Essentials certifications– a tier scheme, requiring external audit and 100% compliance against stringent process and systems criteria.
Managing Director Philip Johnston commented, “with the ongoing risk of high profile global cyber security breaches, everyone needs to be as careful as possible. All parts of the Trackwise group of companies take these issues very seriously, and in once again achieving this accreditation we hope to give our customers, supplier and employees the assurance that, as always, we are totally committed to ensuring the security and protection of their data and of our IT systems and business operations.”
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09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.