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North American EMS Industry Up 22.7% in July
August 26, 2022 | IPCEstimated reading time: 2 minutes
IPC announced the July 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.
Total North American EMS shipments in July 2022 were up 22.7 percent compared to the same month last year. Compared to the preceding month, July shipments decreased 3.2 percent.
EMS bookings in July increased 20.6 percent year-over-year and decreased 6.4 percent from the previous month.
“Demand momentum picked up a bit for the EMS industry in July, but orders are down slightly through the first half of 2022,” said Shawn DuBravac, IPC’s chief economist. “The North American EMS industry continues to face supply chain challenges as indicated by the high book-to-bill ratio, but there are small signs of progress as shipments are up two percent in the first half of year.”
Detailed Data Available
Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.
Interpreting the Data
The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.
IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its nearly 3,000-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Washington, D.C.; Atlanta, Ga.; Miami, Fla.; Munich, Germany; Brussels, Belgium; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.