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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Naprotek Continues to Invest in Technology with BTU PYRAMAX
September 1, 2022 | Naprotek LLCEstimated reading time: 1 minute
Naprotek, LLC., a leading provider of high-reliability, quick-turn electronics manufacturing, has purchased a BTU PYRAMAX reflow oven to provide customers with the most cutting-edge solutions.
"BTU has a well-deserved reputation in the industry for high reliability and providing uniform profiles,” commented Larry Morrissey, Senior VP/GM, Naprotek. “The PYRAMAX is designed to have minimal downtime with its flux management and hassle-free maintenance. The lifetime warranty on the heaters and blowers are a testament to their dependability and have earned the respect of many process engineers. The heating design provides consistent zone-to-zone transition with a negligible delta in temperature setting. This design allows the profiling to be consistent in providing optimal solder joint quality.”
When it comes to reflow solutions, BTU’s PYRAMAX is known worldwide as the performance leader. With closed-loop convection control, the PYRAMAX reflow oven offers the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line.
“BTU is known for its strong customer-centric service support that always is accommodating and with technical support that matches the needs of the most demanding engineers,” added Morrissey.
Naprotek has rapidly expanded to include both West and East Coast operations in California and New Hampshire, respectively. Naprotek is committed to delivering customer value through engineering, supply chain management, and manufacturing support.
BTU International has been the technology leader in the field of thermal processes equipment since 1950 and offers solutions with low operating costs and excellent thermal performance. PYRAMAX reflow ovens beat the competition in thermal uniformity, repeatability and exit temperature – even at higher throughput – and are suitable for processing heavy or complex circuit boards.
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IPC Announces UK Regional Qualification for Hand Soldering Competition
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Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.