Pall Corporation Breaks Ground on US$100M Manufacturing Facility in Singapore
September 1, 2022 | Pall CorporationEstimated reading time: 2 minutes

Pall Corporation, a leader in filtration, separation and purification technology, today broke ground for a new US$100 million state-of-the-art manufacturing facility in Singapore, providing a boost to the semiconductor industry in Asia Pacific (APAC) amidst a global chip shortage. When fully operational, the new facility is expected to more than double Pall’s current production capacity and strengthen its position in Singapore as a regional and global hub for a US$1 trillion industry.
“We expect the APAC region will soon outstrip other markets to become an anchor in the global semiconductor industry. Today, APAC accounts for most of the global semiconductor market. With large-scale investments in Singapore, along with Tsukuba, Japan, Pall is well positioned to offer substantial expertise in advanced node solutions and a vast footprint of technologies to serve the growing demands of chip manufacturers in the region,” says Naresh Narasimhan, President, Pall Corporation.
The facility will occupy a seven-acre campus that will include more than 18,000 square meters of manufacturing and office space. High-volume manufacturing (HVM) and research and development capabilities are planned to be completed between late 2023 and early 2024.
“The US$100 million investment demonstrates Pall’s commitment to help customers meet extremely challenging defect reduction goals amidst a global chip shortage crisis as new technologies, such as 5G, artificial intelligence and automation, evolve and continue to drive transformation,” he added.
Industry megatrends driving demand for semiconductors
As 5G networks become more reliable and widespread, high stakes applications for IoT technology have become increasingly central across healthcare, manufacturing, and automotive industries, among others, driving urgent need for advanced semiconductors.
“For peak chip performance and energy efficiency, it is crucial that semiconductor chips are manufactured at the highest level of purity, especially in new applications such as automotive and medical devices, where latent defects can be costly and pose potential safety hazards. Customers in industries such as telecommunications, deep technology, automotives and transport, rely on Pall’s high-end filtration solutions for each step of the manufacturing process. With this new site, we will incorporate advanced technologies into our processes. We will hire 300 new associates in science, engineering and manufacturing,” says Shangaza Dasent, Vice President and General Manager, Microelectronics, Pall Corporation.
Gracing the groundbreaking ceremony was Mr. Alvin Tan, Minister of State for Trade and Industry and Culture, Community and Youth. He was joined by Mr. Casey Mace, Deputy Chief of Mission for the U.S. Embassy, to celebrate the groundbreaking of Pall’s state-of-the-art manufacturing facility in Singapore.
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.