Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Atotech to Participate at KPCA 2022
September 8, 2022 | AtotechEstimated reading time: 1 minute
Atotech, MKS’ globally leading brand in surface-finishing solutions announced to take part at this year’s KPCA Show to be held at Songdo Convensia, Incheon, Korea, from September 21-23. Experts from MKS’ Atotech and MKS’ ESI brands will be available to discuss latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth: #G201 with the following products on display:
Flex PCB production using UV laser
- Innerlayer treatment & lamination: BondFilm® Series and CupraEtch®Series
- Cu thinning: HyperEtch®
- Via formation: CapstoneTM, 5535TM, RedStoneTM, LodeStoneTM, RedStoneXPTM
- Primary metallization: ViaKing® Series, Neoganth® Activation and Printoganth®
- E’less Cu combined with Uniplate® LB / Polygon platform
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series
HDI PCB production using CO2 laser
- Innerlayer treatment & lamination: BondFilm® and CupraEtch® combined with Horizon® platform
- Cu thinning: HyperEtch®
- Laser pretreatment: BondFilm®LDD combined with Horizon® platform
- Via formation: GeodeTM
- Laser post-treatment: BondFilm®LDD SR combined with Horizon® / Polygon platform
- Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform; Cupracid® Series
IC Packaging production using CO2 laser
- Innerlayer treatment & lamination: NovaBond® Series
- Via formation: GeodeTM A
- Primary metallization: Securiganth®Desmear combined with UniPlate® P, Neoganth® Activator and Printoganth® E’less Cu combined with Uniplate® LB
- Image: AdHere® Series and Imagine DS
- Via Plate/Fill: Inpusle® Series combined with Uniplate® Cu, InPro® Series combined with V-Plate® platform
- Strip and Etch: ResistStrip ® Series, EcoFlash®, Hyperflash®, PallaStrip®
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
Real Time with... IPC APEX EXPO 2025: Exploring Burkle's Innovations at IPC APEX EXPO 2025
03/27/2025 | Real Time with...IPC APEX EXPOBurkle North America's Andy Turner shares insights from the show, highlighting the excitement surrounding the event and Burkle North America's growth potential. He invited attendees to their booth to interact with the InfoCube, a cutting-edge touchscreen showcasing Burkle's diverse product offerings.
All Flex Solutions Upgrades Lamination Layup
01/17/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.