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Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology

11/14/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

11/14/2024 | I-Connect007 Editorial Team
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.

SP Manufacturing and Ideal Jacobs Join Forces to Expand Global Capabilities

11/13/2024 | SP Manufacturing
SP Manufacturing (SPM), a leading provider of Electronics Manufacturing Services (EMS) to mission-critical industries, announced the acquisition of the Asia operations of Ideal Jacobs (IJA). 

TSMC Pioneering Circular Economy in Semiconductor Manufacturing

11/13/2024 | TSMC
TSMC marked a significant milestone in sustainable manufacturing with the inauguration of the Taichung Zero Waste Manufacturing Center.
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