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Indium's Brian O’Leary to Present on EV Electronics Reliability at AIAG Quality Summit
September 14, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will present at the 2022 Automotive Industry Action Group (AIAG) Quality Summit on Oct. 5 in Novi, Michigan, US.
New technology creates new opportunities, but it also creates challenges. As vehicle systems and e-mobility increasingly rely on electronics as part of the design, the number of potential defect points explodes. Automotive’s desire for small and lightweight conflict with the desire for high power and flexibility.
In Achieving Zero Defects in Electronics-Dependent Systems, O’Leary will discuss opportunities for design, material, and process optimization and qualification to achieve high reliability and reach quality metrics while protecting innovation.
O'Leary is responsible for promoting Indium Corporation's full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC EV (Electric Vehicle) Quality & Reliability Advisory Group. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.