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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Empire Expo taking place on September 27th at Rochester Institute of Technology, Rochester, NY. AIM will highlight V9, their new ultra-low-voiding, no clean paste, along with their full line of solder assembly materials.
Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.
To discover all of AIM’s products and services, visit the company at the SMTA Empire Expo on September 27th for more information and to speak with one of AIM’s knowledgeable staff members.
