-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
September 14, 2022 | iNEMIEstimated reading time: 1 minute

Join iNEMI to discuss reliability requirements and challenges posed by the ever-increasing electronics found in today’s automobiles. This workshop will be hosted by ZESTRON on October 20, 2022, 9:00-17:10 at their North Asia Analytical Center & Technical Center in Shanghai.
Automotive electronics is expected to be one of the fastest growing segments in the electronics industry. Automobiles are incorporating more electronics from various industry sectors that have not been optimally designed for use in the automotive environment where conditions are significantly more challenging. Challenges include high power, high and low temperature extremes, vibration, shock, exposure to dirt and contaminants, moisture, chemicals, radiation and gasses, plus reliability expectations beyond typical consumer electronics.
This workshop will provide an interactive forum where participants can discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues effecting the electronics in EVs, including PCBs, solder joints, components, and subsystems
- Material characterization, failure analysis, reliability modeling, standards, and specifications
- Knowledge gaps and collaboration opportunities to address common issues facing the automotive supply chain to speed material and technology development and to mitigate reliability risks and improve yield and quality
The agenda includes speakers from:
- Binjiang Institute of Zhejiang University
- Continental
- ESI Automotive
- IMI Technology
- SAIC-VOLKSWAGEN
- NXP Semiconductors
- NIO
- ZESTRON
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.