-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA International Expo Features Networking Program for Electronics Manufacturing Industry Newcomers
September 15, 2022 | SMTAEstimated reading time: 1 minute

The SMTA will host a networking event for young professionals and people new to the electronics manufacturing industry during the SMTA International Exposition on November 2 and 3, 2022 in Minneapolis, MN, USA.
“Passport to the World of SMT” is an interactive, in-expo networking event designed specifically to introduce newcomers to the industry’s top technical resources. Participants, called “Explorers” during the event, will receive passports to collect stamps from “Ambassadors” in designated booths on the show floor. When the Explorers introduce themselves, they will learn about the technology, get to ask questions, and exchange business cards. This FREE event is hosted by the SMTA Student and Young Professionals committee and is open to all attendees.
The program kicks off at 10 AM on Wednesday, November 2 with an opening reception and continental breakfast. During this meeting explorers will receive their passports and hear about the importance of networking from hosts Sal Sparacino, ZESTRON Americas, and Chrys Shea, Shea Engineering.
Explorer Passports will be organized in the order of a typical SMT process:
- Printing and SPI
- Placement
- Automated Optical Inspection (AOI)
- Mass Soldering
- Cleaning
- X-ray and Test Methods
- Rework and Hand Soldering
Ambassadors’ booths will be marked with flags, and Ambassadors will be easily identified by their special badges. Explorers will be able to walk the show floor and meet with Ambassadors at their own pace during the two-day expo. The program concludes at 1:00 PM on Thursday, September 3 in the SMTA Member Lounge when prizes will be awarded for the most active Explorers and their favorite Ambassadors.
L3Harris Technologies’ Adam Klett, Ph.D., chairperson of the Students and Young Professionals committee, explains the driver for this unique program, “We realize the incredible importance of linking tomorrow’s technology leaders with today’s Subject Matter Experts. These newer engineers need to know who to call when they face design and production challenges, and we all need to capture some of the experience and know-how from the technologists who grew up with surface mount technology since its inception.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.