Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
September 2022 Issue of PCB007 Magazine Available Now
September 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In this issue of PCB007 Magazine, we explore ideas for mechanization/automation of your existing facility. At first blush, this theme would suggest a major concentration on manufacturing floor details, or maybe a heavy dose of new capital equipment and line design topics. As you'll learn, it's much more than that.
In our kick-off expert interview, Alex Stepinski makes the strategic-level case for a specific set of duties to be performed by a chief technology officer. Also featured in this issue: Michael Carano, speaking on the IPC Thought Leaders program and his insights on the industry and why upgrading capabilities are essential, plus Dana Korf discussing developments in materials that influence manufacturing processes. This brings us back to updating our brownfield facilities.
The rest of the issue contains articles and columns examining the technical details of board fabrication: microvia reliability advances, automating wet processes; thoughts on the manufacturing industry, and more.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
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