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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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September 2022 Issue of PCB007 Magazine Available Now
September 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In this issue of PCB007 Magazine, we explore ideas for mechanization/automation of your existing facility. At first blush, this theme would suggest a major concentration on manufacturing floor details, or maybe a heavy dose of new capital equipment and line design topics. As you'll learn, it's much more than that.
In our kick-off expert interview, Alex Stepinski makes the strategic-level case for a specific set of duties to be performed by a chief technology officer. Also featured in this issue: Michael Carano, speaking on the IPC Thought Leaders program and his insights on the industry and why upgrading capabilities are essential, plus Dana Korf discussing developments in materials that influence manufacturing processes. This brings us back to updating our brownfield facilities.
The rest of the issue contains articles and columns examining the technical details of board fabrication: microvia reliability advances, automating wet processes; thoughts on the manufacturing industry, and more.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
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09/17/2025 | I-Connect007 Editorial TeamManufacturers in the U.S. are cutting jobs even as President Donald Trump pushes policies he says will revitalize the industry. Employers shed 12,000 manufacturing jobs in August, while payrolls in the sector have fallen by 42,000 since April, according to a new analysis from the Center for American Progress (CAP) based on government labor data.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
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GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
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STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
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