I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Seems well-timed, actually. Trade show season kicks off with the first major conference in early October and continues into the spring of 2023. So, if you haven’t yet spent time with this association news, now’s your chance. Have a great weekend, everyone!
IPC Symposium Puts Spotlight on IC Substrate and Package Assembly
Published September 9
This inaugural two-day symposium on advanced packaging technology aims to move past the hype and focus on the business and technology for IC packaging. Twenty-eight speakers will fill out eight different sessions. For industry professionals for whom packaging advanced packaging R&D is of interest, this symposium is a must. Get all the details from IPC here.
Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits
Published September 12
Industry pioneer and I-Connect007 columnist Joe Fjelstad sees a rise in interest in flex circuitry applications. Joe updates us on the progress in developing stretchable materials for use in applications such as wearable devices. He also highlights the work done by the NextFlex organization to provide a demonstration center which engineers can use as a lab space to get comfortable with flex materials. If you’re looking into how flex works for your applications, click through here.
Women’s Leadership Program Announces Presentation Program during SMTA International 2022
Published September 15
SMTA is sponsoring a Women’s Leadership Program as a part of the upcoming SMTA International 2022 conference and exposition in Minneapolis. Chairing the two presentation sessions and the social to follow are Tanya Martin, Jessica Molloy, Debbie Carboni, Julie Silk, Michelle Ogihara, and Sherry Stepp. The event is free; everyone is welcome to attend. Find more information here.
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
Published September 14
Oct. 20 in Shanghai is where ZESTRON and iNEMI will host a workshop on the requirements and challenges facing electronics reliability for automotive applications. The speakers list is a deep pool of automotive electronics talent. If automotive is your area of interest, this is a valuable resource.
Pricing Strategies With Michael Carano
Published September 13
We spoke with Mike Carano, vice president of quality at Averatek, I-Connect007 columnist, and member of the IPC Thought Leaders Program, about the current market pressures on pricing. Carano had some interesting insights to share on the subject, and some strategies for increasing margins through pricing, yield and technology improvements. Spoiler alert: Many fabs are clawing back margin they gave up over the years.
Passing the Test With SMTA’s Rob Boguski
Published September 14
Andy Shaughnessy recently spoke with Rob Boguski, president of Datest, an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years. Whether test is your jam, or SMTA long-range planning is, you certainly should give this interview a read.
Suggested Items
IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.