I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Seems well-timed, actually. Trade show season kicks off with the first major conference in early October and continues into the spring of 2023. So, if you haven’t yet spent time with this association news, now’s your chance. Have a great weekend, everyone!
IPC Symposium Puts Spotlight on IC Substrate and Package Assembly
Published September 9
This inaugural two-day symposium on advanced packaging technology aims to move past the hype and focus on the business and technology for IC packaging. Twenty-eight speakers will fill out eight different sessions. For industry professionals for whom packaging advanced packaging R&D is of interest, this symposium is a must. Get all the details from IPC here.
Flexible Thinking: The Rapidly Expanding Realm of Stretchable Circuits
Published September 12
Industry pioneer and I-Connect007 columnist Joe Fjelstad sees a rise in interest in flex circuitry applications. Joe updates us on the progress in developing stretchable materials for use in applications such as wearable devices. He also highlights the work done by the NextFlex organization to provide a demonstration center which engineers can use as a lab space to get comfortable with flex materials. If you’re looking into how flex works for your applications, click through here.
Women’s Leadership Program Announces Presentation Program during SMTA International 2022
Published September 15
SMTA is sponsoring a Women’s Leadership Program as a part of the upcoming SMTA International 2022 conference and exposition in Minneapolis. Chairing the two presentation sessions and the social to follow are Tanya Martin, Jessica Molloy, Debbie Carboni, Julie Silk, Michelle Ogihara, and Sherry Stepp. The event is free; everyone is welcome to attend. Find more information here.
iNEMI Workshop: Reliability Challenges and Solutions for Automotive Electronics
Published September 14
Oct. 20 in Shanghai is where ZESTRON and iNEMI will host a workshop on the requirements and challenges facing electronics reliability for automotive applications. The speakers list is a deep pool of automotive electronics talent. If automotive is your area of interest, this is a valuable resource.
Pricing Strategies With Michael Carano
Published September 13
We spoke with Mike Carano, vice president of quality at Averatek, I-Connect007 columnist, and member of the IPC Thought Leaders Program, about the current market pressures on pricing. Carano had some interesting insights to share on the subject, and some strategies for increasing margins through pricing, yield and technology improvements. Spoiler alert: Many fabs are clawing back margin they gave up over the years.
Passing the Test With SMTA’s Rob Boguski
Published September 14
Andy Shaughnessy recently spoke with Rob Boguski, president of Datest, an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years. Whether test is your jam, or SMTA long-range planning is, you certainly should give this interview a read.
Suggested Items
Tax Policy Update from IPC: The House Tax Bill, and What It Means for Electronics Manufacturers
05/20/2025 | IPCOn May 13, the House Ways and Means Committee advanced a major tax package that includes several provisions supported by IPC. These provisions—including restoring bonus depreciation, immediate R&D expensing, and strengthening the pass-through deduction—were identified by IPC members as key tools that would help them invest, grow, and compete more effectively.
Zero Touch Data Package: The Future of Seamless PCB Manufacturing
05/22/2025 | Dana Korf, Victory Giant TechnologyImagine a day when a design data file—not a traditional documentation package—is output directly from the eCAD system, transmitted to selected fabricators, and automatically loaded into their engineering/CAM systems, initiating tooling and production without any human intervention. This is zero touch data transfer in action. By eliminating manual processes, front-end personnel at fabrication facilities can be redeployed to strategic areas such as R&D and customer engagement.
Trouble in Your Tank: Yield Improvement and Reliability
05/22/2025 | Michael Carano -- Column: Trouble in Your TankThere’s a simple rule of business in manufacturing: “It is all about yields.” Higher yields for your products allow for increased profits and satisfied customers. When there are lower yields, overall cost to manufacture increases, and the additional time and strain on the factory floor affect the entire operation. Lower yields are often the result of “process drift,” when critical process parameters and specialized plating additives fall outside their acceptable ranges.
Recognizing IPC Scholarships, Awards, and Opportunities
05/21/2025 | Charlene Gunter du Plessis, IPC Education FoundationThere was no better way to end our year in 2024 than by recognizing hard-working and driven students and educators for their involvement and interests in the electronics manufacturing industry. Through the IPC Scholarship and Awards program, we can help students invest in their future and reward their hardworking and dedicated accomplishments.
IPC Report Recaps Imperatives in Global Chip Race
05/19/2025 | IPCWith funding awards under the U.S. CHIPS and Science Act currently under review, IPC just shared a new Industry Intelligence Report focused on the issues and players involved.