Nolan’s Notes: Tariffs, Technologies, and Optimization
Global Sourcing Spotlight: Finding the Balance Between Cost and Quality
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Jabil Photonics Announces Availability of Next-Gen Coherent Optical Products
September 20, 2022 | JabilEstimated reading time: 1 minute
Jabil Inc. announced that its photonics business unit continues to drive the design and development of world-class optical communications products with general availability and customer testing of its CFP2 DCO ECO Coherent Transceiver. This latest module, based on Nokia’s CSTAR200+ silicon photonics optical engine, is designed to deliver best-in-class optical performance while adhering to recent communications standards requirements. Demonstrations of this second-generation coherent optical module will take place at the Jabil Photonics booth (#116) during ECOC 2022.
As a leading provider of customized design, manufacturing and test solutions for optical communications products, Jabil Photonics invests in advanced solutions and capabilities to address evolving network requirements and architectures. An extensive product line encompasses discrete optical components, integrated modules and complex, fiber-based boards supported by unique design, process and test engineering skills and services.
“We are pleased to integrate Nokia’s CSTAR-200+ optical engine as part of our complete coherent transceiver solution,” said KW Hoo, GM of Jabil Photonics. “Together, we can accelerate the pace of technology advancements while bringing industry-leading optical products to market faster on behalf of customers worldwide.”
End-to-End Capabilities Reduce Optical System Complexities
Jabil Photonics offers the coherent technologies and solutions required for a wide range of applications, including 5G, metro networking and data-center interconnects. Moreover, the second-generation 100G/200G modules comply with the most recent communications standards requirements while minimizing power consumption with the most recent Digital Signal Processing (DSP) and optical-engine technologies.
Jabil Photonics empowers organizations to reduce the complexities of developing and deploying enhanced optical networking solutions by offering complete end-to-end photonics capabilities and competencies encompassing component design, system assembly and streamlined supply chain management. Tailored services for optical design, packaging and precision manufacturing are complemented by dedicated R&D and production facilities in California, Canada, China and Malaysia.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Mouser Electronics Celebrates Its 2025 Best-in-Class Award Winners
10/01/2025 | BUSINESS WIREMouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is pleased to announce the 2025 recipients of the Mouser Best-in-Class Awards.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
09/25/2025 | BUSINESS WIRECadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.