Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Koh Young KPO Printer Technology Wins Best Process Control Software at SMTA Guadalajara Expo & Tech Forum
September 22, 2022 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the industry-leader in True 3D measurement-based inspection solutions, is proud to announce its KPO Printer technology earned the Mexico Technology Award for Process Control Software from Mexico EMS. We accepted the award from Ronald Friedman, Publisher of Mexico EMS, during the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico on September 2022.
Product miniaturization is driving smaller apertures, finer solders, and complex designs, which makes printing a sophisticated process with significant impact on yield. Typically, print process expert must constantly adjust print parameters to ensure a stable process. Yet, Koh Young is driven to create an autonomous, connected electronics manufacturing environment for defect-free production using its growing suite of AI-powered process optimization tools.
The latest solution is KPO Printer (Koh Young Process Optimizer for Printers), which uses a proprietary Artificial Intelligence (A.I.) engine we developed locally to help machines solve print process challenges. KPO Printer exercises complex algorithms to diagnose issues, recommend parameters, and improve print quality. With our own AI and Machine Learning tools, KPO Printer:
- Analyzes relationships between programs and print parameters to determine if the current printer settings can facilitate a printer DOE
- Optimizes the print process with real-time printer and Solder Paste Inspection (SPI) data correlation to recommend ideal process parameters
- Provides real-time performance diagnostics with anomaly detection algorithms to identify and alert users about process issues and trends
“In short, KPO Printer defines the optimal parameter settings and eliminates the need for trial-and-error experiments”, commented Ray Welch, a Senior Applications Engineer at Koh Young. KPO Printer uses active communication between the printer and SPI to implement necessary process changes in real-time. “We make print process optimization easy. Our AI-powered solution delivers automated process reliability and consistency, allowing manufacturers to achieve greater productivity and efficiency. KPO Printer is the evolved solution for process reliability without expertise.”
To learn more about how our KPO Printer technology can increase your quality, visit us at the SMTA Guadalajara Expo in booth 425 or at the SMTA International Expo in Minneapolis, Minnesota in booth 925 between 01-03 November 2022.
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.