Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
MacDermid Alpha to Present Next Generation Assembly at TechBlick 2022
October 3, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper ‘Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces’ at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.
Rahul Raut, Global Portfolio Manager – FFPE at MacDermid Alpha, will discuss the key building blocks of 3D smart structural platforms, covering novel film substrates which include multifunctional PC substrates for In-Mold Electronics, highly conductive and formable Silver Inks, high performance formable Dielectrics, formable structural and electrically conducting adhesives (ECAs) and formable encapsulants. The performance and capability of integrated multi-layer stacks that can be thermoformed and then injection molded to produce smart, interactive 3D structures will be presented, as well as the ability of these integrated 3D structures to meet or exceed the stringent reliability requirements for automotive, medical, white goods and other demanding applications.
MacDermid Alpha’s suite of electronic inks, coatings and film materials are designed to meet the unique functional and reliability requirements for In-Mold Electronics, Functional HMI (Human-Machine Interface) Surfaces and Adhesively Laminated FPCs. We offer a comprehensive suite of fully compatible materials, processing and applications support for our films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI Structures. Our film capabilities include functional and decorative solutions, such as heat-stabilized Autostat PET and XtraForm PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide an inter-compatible comprehensive solution of electronic materials, films and processes.
Rahul Raut will present the technical paper on Wednesday 12th October at 3.20pm during the TechBlick Conference. MacDermid Alpha will also participate in the TechBlick expo, visit us at tabletop number 38 to discuss our latest technologies for 3D In-Mold Electronics. To register for TechBlick's website.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: We’ve Got It Covered
04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.
Zenaida Valianu, IPC, Earns IPC Excellence in Education Award at IPC APEX EXPO 2025
03/31/2025 | IPCThe IPC Excellence in Education award was presented to Zenaida (Zenny) Valianu, IPC, at IPC APEX EXPO 2025, recognizing her significant contributions to workforce development and leadership.
TTCI and TTC-LLC to Exhibit and Sponsor at SMTA Tech & Expo Forums in Dallas and Houston
03/27/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) are proud to announce their participation as exhibitors and sponsors at the upcoming Dallas SMTA Tech & Expo Forum on April 1, 2025.