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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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American Standard Circuits Successfully Completes AS9100:D and ISO 9001:2015 Audits
October 10, 2022 | American Standard CircuitsEstimated reading time: Less than a minute

American Standard Circuits has passed their most recent AS9100:D and ISO 9001:2015 audits which cover all interconnect products for military, aerospace, medical, communications and other high-tech markets.
“Passing these intensive audits is a tribute to the entire team at American Standard Circuits,” commented president and CEO Anaya Vardya. “Because we are so heavily invested in working with the defense and aerospace market it is important that we are always up to date with our specs and qualifications. It is important to pass these audits and retain our qualifications, but it is critical that we sustain and continually improve the processes that these systems control. This is another proud achievement for our ever-growing company.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.