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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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Auction to Feature PCB Manufacturing & Plant Support Equipment
October 4, 2022 | Surplus Solutions, LLCEstimated reading time: 1 minute

Surplus Solutions, LLC, a Global Industrial Auction Company, in conjunction with Infinity Asset Solutions will conduct a major online auction to sell the assets of Milplex Circuit Canada, Inc. located at 70 Maybrook Drive, Scarborough, (Toronto) Ontario, Canada.
Milplex Circuit (Canada), Inc. was an industry leader in the fabrication of thermally conductive printed circuit boards. They had the expertise to fabricate single sided, double side, multilayer, and sequential lamination multilayer thermally conductive constructions. Milplex also provided aluminum copper backed or aluminum and copper core solutions. The Online Auction will open on Monday, October 17th, 2022 and will begin closing on Thursday, October 20th, 2022 at 11:00 AM EST. There will be a preview & inspection open to the public on Monday, October 17th from 9:00 a.m. - 4:00 p.m.
Featured items will include:
· 2008 Orbotech Model Discovery 8000 AOI
· 2010 Camtek Model Orion 860 AOI/ Inner & Outer Layer Inspection
· Mania Vertical Flying Probe Testers
· (4) Multiline Post Etch Auto Artwork Punches
· (10) Excellon & Hitachi CNC Drilling & Routing Machines
· OEM & TMP Lamination Press Machines
· Accuscore AS-200 CNC & AS 150 JN Scoring Systems
· Wet Process, Plating Lines, Solder Mask Equipment
· (8) Olec & ORC Single & Double Sided Exposure Units
· Plant & Facility Support, Spare Parts, Ovens, 2018 Air Compressor, Tools, Racking
· Much More, Inventory, Raw Material, Over 350 Lots
According to Jason Hayne, vice president at Infinity Asset Solutions, “The Milplex Circuit Canada Online Auction will provide buyers a unique opportunity to purchase printed circuit board manufacturing equipment & plant support assets at a reduced cost with no delays. All of the assets are available immediately with no supply chain issues or any delays. The 50,000 Sq Ft Facility is packed with printed circuit board manufacturing equipment as well as a large quantity of plant support Assets.”
Auctioneer accepting Pre Auction offers on major equipment. All interested parties can find full auction details including equipment listings, photos, videos, lot catalog, and bidding instructions here.
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.