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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Meet ICAPE Group at Electronica
October 5, 2022 | ICAPE GroupEstimated reading time: 1 minute
On November 15-18 2022, ICAPE Group will be present at the biggest electronic trade fair in the world. More than 30 sales engineers and technical experts from all over Europe will be meeting customers, prospects, and media in booth Hall A1 booth N°506 and will host many technical keynotes during the week.
Save the date! ICAPE Group, one of the largest PCB suppliers in the world, has an eventful program for the 46th week of 2022. All the electronic industry will attend the biggest trade fair, and ICAPE will be present as a host. At their amazing booth, a team of 30 experts will be available to share their technical knowledge and solutions for every printed circuit board and technical parts need.
During the year, ICAPE Group’s technical free webinars allow deciders of the industry to deepen their knowledge of complex electronic components. At Electronica, technical experts of ICAPE Group will show up on stage and will be available to help you to take strategic decisions regarding designs, technology, and much more! You will also attend special events during this week such as the launch of ICAPE Group’s new E-Shop platform, exclusively unveiled at Electronica. Don’t miss the opportunity to experience the power of precision!
ICAPE Group: The Expert Way to Order PCBs and Technical Parts, From Prototype to Large Volumes
Since 1999, ICAPE Group is the strategic partner to manufacture products that transport us, entertain us, save us, or connect us. From design to delivery, ICAPE Group manages each electronic project with transparency and expertise.
Access the world's best network of PCB and technical parts manufacturing options, through ICAPE Group’s local business units all around the world or directly online with the most optimized costs, lead times, and sustainable processes.
Suggested Items
The ICAPE Group Announces the Launch of Its E-Shop at Electronica
10/31/2024 | BUSINESS WIREThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.
DuPont Earns Best Partner Award for Innovation from Samsung Electronics
10/31/2024 | DuPontDuPont announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category.
Are Firms Holding Too Much Inventory?
10/30/2024 | Shawn DuBravac, IPCIn the aftermath of the 2008 financial crisis, manufacturers made significant adjustments to inventory management strategies as they faced sharp declines in demand and economic uncertainty. Manufacturers moved to scale back production and attempted to quickly reduce inventory levels. Post-crisis, many manufacturers adopted lean inventory practices, such as just-in-time (JIT) production, to minimize holding costs and illiquidity risks.
Combatting Advanced Techniques in Counterfeiting
10/30/2024 | Anthony BryantIn today's interconnected global marketplace, counterfeit electronics pose a significant threat to industries ranging from aerospace and defense to healthcare and telecommunications. As counterfeiters employ increasingly sophisticated techniques, the need for robust strategies to prevent, mitigate, and identify counterfeit components has become critical. This article explores the advanced techniques used in counterfeiting, the potential involvement of state-owned enterprises (SOEs), and comprehensive strategies for combating this pervasive issue.
ESCATEC Pushes New Boundaries in Micro-electronics with UV Enhanced Die Bonder Technology
10/30/2024 | ESCATECElectronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.