-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Sanmina, Reliance Complete Previously Announced Manufacturing Joint Venture Transaction in India
October 6, 2022 | Sanmina Corp.Estimated reading time: 1 minute

Sanmina Corporation, a leading integrated manufacturing solutions company and Reliance Strategic Business Ventures Limited (RSBVL), a wholly-owned subsidiary of Reliance Industries Limited (RIL), India's largest private sector company, announced they have completed the previously announced joint venture transaction.
This partnership will leverage Sanmina's 40 years of advanced manufacturing experience and Reliance's expertise and leadership in the Indian business ecosystem. The day-to-day business will continue to be managed by Sanmina's management team in Chennai, which will be seamless from an employee and customer perspective.
The joint venture will create a world-class electronic manufacturing hub in India, in line with the Hon'ble Prime Minister's "Make in India" vision. The joint venture will prioritize high technology infrastructure hardware, for growth markets, and across industries such as communications networking (5G, cloud infrastructure, hyperscale datacenters), medical and healthcare systems, industrial and cleantech, and defense and aerospace. In addition to supporting Sanmina's current customer base, the joint venture will create a state-of-the-art 'Manufacturing Technology Center of Excellence' that will serve as an incubation center to support the product development and hardware start-up ecosystem in India, as well as promote research and innovation of leading-edge technologies.
All the manufacturing will take place at Sanmina's 100-acre campus in Chennai, with the ability for site expansion to support future growth opportunities as well as to potentially expand to new manufacturing sites in India over time based on business needs.
Suggested Items
NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
07/11/2025 | PRNewswireTaking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.
Mycronic Delivers Strong Q2 Performance and Raises 2025 Outlook to SEK 7.5 Billion
07/11/2025 | MycronicMycronic reported a 35% increase in Q2 net sales and a 27% EBIT margin, prompting an upward revision of its full-year 2025 revenue forecast to SEK 7.5 billion.
Cetec ERP Expands into Larger Office to Support Continued Growth
07/11/2025 | Cetec ERPCetec ERP, a leading provider of cloud-based ERP software for manufacturers, has officially relocated to a larger, modern office facility in central Austin as of July 2, 2025.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Kitron Reports Strengthening Momentum in Q2 2025
07/10/2025 | KitronKitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector.