-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation Adds Two Members to Engineered Solder Materials Team
October 6, 2022 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation is pleased to announce two new additions to its Engineered Solder Materials (ESM) team—Igor Faleichik, senior product specialist, and Jim McCoy, product specialist.
Faleichik assumes responsibility for creating, driving, and supporting initiatives to grow his product lines, with a focus on the connector and RF infrastructure markets for ESM. He researches and analyzes customer and market data for his respective products to understand market trends and technical inflection points. He also supports current and prospective business while serving as a product line resource to coordinate activities among internal departments, including sales, manufacturing, quality assurance, and research and development to advance product growth.
Faleichik brings more than 10 years of industry experience to his new role. He previously served as a sales manager, business development manager, and a marketing consultant—roles that have allowed him to cultivate and nurture strategic business partnerships and develop targeted business initiatives. Most recently, he served as president of an infrared optical component manufacturer.
Faleichik holds both a bachelor’s degree and a master’s degree in marketing from Siberian State Aerospace University. He holds a business certificate in First Principles of Computer Vision from Columbia University, is a certified associate in project management, and is a Certified Lean Six Sigma Yellow Belt.
McCoy is responsible for researching and aligning customer needs with product capabilities to facilitate current and prospective business within the Engineered Solder Materials segment. His focus is on solder preform technology for power electronics applications and he serves as a product line resource to customers and internal departments to address the growing market.
McCoy joined Indium Corporation in 2014 as a talent acquisition coordinator and was promoted to a supervisor role in 2017. During his time with the human resources department, McCoy developed close working relationships with hiring managers and many other members of the community. He was instrumental in creating, developing, and leading Indium Corporation’s award-winning summer college internship program.
McCoy holds a bachelor’s degree in business administration from Western New England University and an MBA in technology management from the State University of New York Polytechnic University. He is a Lean Six Sigma Yellow Belt and a graduate of the Dale Carnegie Leadership Skills for Success program.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.