-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation Adds Two Members to Engineered Solder Materials Team
October 6, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is pleased to announce two new additions to its Engineered Solder Materials (ESM) team—Igor Faleichik, senior product specialist, and Jim McCoy, product specialist.
Faleichik assumes responsibility for creating, driving, and supporting initiatives to grow his product lines, with a focus on the connector and RF infrastructure markets for ESM. He researches and analyzes customer and market data for his respective products to understand market trends and technical inflection points. He also supports current and prospective business while serving as a product line resource to coordinate activities among internal departments, including sales, manufacturing, quality assurance, and research and development to advance product growth.
Faleichik brings more than 10 years of industry experience to his new role. He previously served as a sales manager, business development manager, and a marketing consultant—roles that have allowed him to cultivate and nurture strategic business partnerships and develop targeted business initiatives. Most recently, he served as president of an infrared optical component manufacturer.
Faleichik holds both a bachelor’s degree and a master’s degree in marketing from Siberian State Aerospace University. He holds a business certificate in First Principles of Computer Vision from Columbia University, is a certified associate in project management, and is a Certified Lean Six Sigma Yellow Belt.
McCoy is responsible for researching and aligning customer needs with product capabilities to facilitate current and prospective business within the Engineered Solder Materials segment. His focus is on solder preform technology for power electronics applications and he serves as a product line resource to customers and internal departments to address the growing market.
McCoy joined Indium Corporation in 2014 as a talent acquisition coordinator and was promoted to a supervisor role in 2017. During his time with the human resources department, McCoy developed close working relationships with hiring managers and many other members of the community. He was instrumental in creating, developing, and leading Indium Corporation’s award-winning summer college internship program.
McCoy holds a bachelor’s degree in business administration from Western New England University and an MBA in technology management from the State University of New York Polytechnic University. He is a Lean Six Sigma Yellow Belt and a graduate of the Dale Carnegie Leadership Skills for Success program.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007eBooks library.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Frank Sommer Discusses Selective Soldering Innovations for EVs
04/10/2026 | Real Time with... APEX EXPODan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.