-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Yield Engineering Systems Partners with Benchmark for Global Engineering and Manufacturing Support
October 10, 2022 | PRNewswireEstimated reading time: 1 minute
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced it is partnering with Yield Engineering Systems (YES) to transfer the manufacturing of the YES flagship product line to its facility in Malaysia, as well as providing engineering and manufacturing support for YES's upcoming innovative modular wet process systems in the Phoenix, Arizona area.
"We have developed a strong partnership with Benchmark built on trust and our combined expertise," said Ramakanth Alapati, Chief Executive Officer of YES. "We look forward to working closely with the team to bring our technology to a wider market, and to further expanding our footprint in the semiconductor capital equipment industry as the need for semiconductor manufacturing support continues to grow worldwide."
YES is at the leading edge of material modification and surface enhancement solutions. The company's patented technologies significantly enhance the speed, reliability, and cost-effectiveness of semiconductor production processes. YES's thermal, deposition, and wet process systems provide critical technology to semiconductor, life science, and display manufacturers large and small as they work to meet the demand for semiconductors, genomics, point of care diagnostics, and innovative displays.
Benchmark's Phoenix operation will be leveraging the company's deep expertise in the semiconductor capital equipment market, including mechatronic engineering, precision machining, and sub-system assembly. The partnership comes at a critical time as the CHIPS Act has created a flurry of activity around the semiconductor industry and demand for organizations supporting the industry has risen dramatically.
"YES is helping solve critical problems for their customers in the fast-growing semiconductor manufacturing industry," said Jeff Benck, president and CEO, Benchmark. "We're proud to be selected as their strategic partner and look forward to working hand-in-hand with their team to help bring their technology to market to meet the demand for semiconductor capital equipment."
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.