Ventec Expands U.S. Team with New Director OEM Sales & Business Development
October 10, 2022 | VentecEstimated reading time: 1 minute

Ventec International Group Co., Ltd. is pleased to announce that Chad Wood has joined the company’s U.S. team. As Director OEM Sales & Business Development, Chad will drive business development, sales & support services for OEM customers predominantly in the Western region of the USA. His focus will be on Ventec’s core automotive, mil/aero, medical, lighting and network technology market segments, which typically require reliable thermal management materials (such as Ventec’s tec-thermal range) as well as high-speed and high-frequency material solutions (tec-speed).
Chad joins Ventec as an experienced technical sales leader who has worked in the electronics and semiconductor industries for more than 28 years. Since 2009, Chad has been involved in developing industry-leading thermal solutions for the most demanding applications that require sustainable and reliable materials that optimize product performance for tier-1 OEMs in the automotive, lighting, power and industrial, and telecom/datacom markets. From his home base in southern California, Chad will focus on bringing design wins and qualifications for all Ventec products from customers in the western region of the USA. He will also be responsible for Ventec's manufacturer rep sales teams on the west coast.
Chris Hanson, Global Head IMS Technology at Ventec comments: "Chad brings with him strong relationships with decision makers at the OEM and fabricator level. To support our continued growth, driven by a significant rise in demand for our solutions in the USA and beyond, our expanding team ensures that we continue to provide industry-leading technical support services. We are delighted to welcome Chad to Ventec as our latest member of the OEM sales team."
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: Everyone Has Their Eye on India
09/03/2025 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.