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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IEC Sells ModVIA Expandable Plasma System from Nordson to APCT
October 11, 2022 | IEC Inc.Estimated reading time: Less than a minute
APCT, headquartered in Santa Clara, CA, with four total manufacturing sites, is an industry leading manufacturer of Rigid, Rigid Flex, and Flex circuit boards. Together with IEC and Nordson, APCT recently installed two brand new Nordson ModVIA Expandable Plasma Treatment systems. One machine went to APCT’s Orange County location, whilst the other was installed in their Wallingford, CT, facility.
The ModVIA system utilizes high flux electrodes to create a uniform plasma treatment across the PCB panel, including desmear and etchback should it be required. This system can process Rigid and Flexible PCB panels and is suitable for blind via and through-hole applications. Finally, the system can utilize a wide range of gasses to ensure every customer’s specific needs.
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Sikorsky, Robinson Unmanned Win U.S. Marine Corps Autonomous Logistics Contract
04/28/2026 | Lockheed MartinThe United States Marine Corps awarded a $15.5 million contract to Sikorsky, a Lockheed Martin company, for the Medium Aerial Resupply Vehicle – Expeditionary Logistics (MARV-EL) Increment 2 program.
Skoltech Team Develops Modulator for Compact Photonic Integrated Circuits
04/28/2026 | SkoltechResearchers at Skoltech have developed an ultra-compact electro-optic modulator based on silicon photonics and plasmonics that enables high-efficiency optical signal control within a small device footprint.
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).