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IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts
October 13, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe.
If the discussion on the opening day established the nature of the capabilities gap that the U.S. and Europe are facing in advanced packaging, the agenda on the second day made it clear just how big the gap is, both strategically and economically. Significant investment is needed.
For example, during the panel discussion with representatives from companies such as Calumet, TTM, and GreenSource Fabrication, it was suggested that an advanced packaging facility will require two orders of magnitude more cleanroom area than a current traditional PCB fab, and that it will likely cost a minimum of times of a traditional PCB fab to construct. A greenfield would be the best approach.
One thing was crystal clear from the presentations and hallway conversations: Advocacy groups (IPC, PCBAA and USPAE) have made real headway with legislators. In his closing remarks, IPC Chief Technologist Matt Kelly said that legislation has been adopting industry language as things move forward. His implication was that legislators and their staff are learning enough from the advocates to begin to understand the issues and use the appropriate terminology.
The symposium, which ran from Oct. 11–12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended. I think the program succeeded in exposing the urgency and the magnitude of the need to support advanced packaging in all regions of the globe. What needs to happen next is ongoing work to focus the efforts, educate manufacturers and legislators, use government funding wisely, and to look at this as an ongoing process for as much as 10 years.
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IPC Raymond E. Pritchard Hall of Fame Award: Pierre-Jean Albrieux
05/10/2024 | Marcy LaRont, PCB007 MagazineCongratulations to Pierre-Jean Albrieux, who received the 2024 IPC Raymond E. Pritchard Hall of Fame Award. The award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and toward the advancement of the industry, including helping to create a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC.
IPC Focuses on Education and Onboarding
05/09/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with Carlos Plaza, senior director of education for IPC, about expanding educational efforts in the PCB design, fabrication, and assembly segments. As Carlos explains, PCB design is a hot topic, but onboarding may be the hottest one of all.
Real Time with… IPC APEX EXPO 2024: Industry Growth, Challenges, and Technological Advancements
05/09/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Shawn DuBravac, IPC chief economist, dive into key industry topics such as growth, challenges, and technological advancements. They discuss shifts in the global competitive landscape, downstream demand, customization, and how AI is enhancing human skills. The industry outlook appears promising for both the short and long term.