-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MKS’ Atotech to Participate at TPCA Show and IMPACT 2022
October 17, 2022 | AtotechEstimated reading time: 1 minute

Atotech, MKS Instruments’ globally leading brand in surface-finishing solutions, will participate at this year’s Taiwan Circuit Industry International Exhibition (TPCA Show) and International Microsystems, Packaging, Assembly and Circuits Technology Conferences (IMPACT) to be held in Taipei, Taiwan from October 26-28, 2022.
Daniel Schmidt, Director Global Marketing Electronics at MKS’ Atotech said: “This year, the list of leading technology firms which join and present at this unique event is extraordinary. We are excited to host two IMPACT industrial forums, one on ‘High-speed computing for edge computing applications’ and one on ‘Advanced packaging for data and server applications.” Atotech experts will contribute two paper presentations during these sessions on October 26. In addition, Atotech experts will present five more technical papers on October 27 and 28, at the regular IMPACT technical conference.
Throughout TPCA show, experts from MKS’ Atotech and ESI brands will be available at booth 4F: #N-720 to discuss latest industry trends and challenges. To the audience, they will introduce the new combined product offering, consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service.
Product highlights at the show include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- EcoFlash® S300: Differential etching for advanced SAP manufacturing
- CapstoneTM: High-performance breakthrough productivity for flex PCB UV drilling
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- InPro® SAP6: The new standard for IC substrates – High current density, productivity, and quality
- Printoganth® MV TP2: Next-generation electroless copper for fine-line SAP applications
- Stanna-CAT®: A new autocatalytic process for tin deposition
- NEAP: Non-etching adhesion promoter for lead frames
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30