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Vayo Technology Hosts Online Launch of DFX Execution System
October 17, 2022 | Vayo TechnologyEstimated reading time: Less than a minute
On October 11, Vayo Technology hosted the online launch of its new DFX Execution System. DFX Execution System is a high-level DFX analysis software solution designed for large OEM/EMS companies to execute DFX analysis to ensure high quality PCB/PCBA design.
Vayo Technology launched the first revision of DFM/DFA application software (VayoPro-DFM Expert) in 2008. It won the IPC innovation award as a powerful 3D solution in 2019.
While application software suits small teams, large organizations can benefit from a web-based system solution, allowing greater interaction and more effective solutions for both design and process teams.
Founded in 2005, Vayo Technology Co., Ltd is a highly innovative software technology enterprise dedicated to intelligent NPI software solutions for electronics companies spanning design to manufacturing. Vayo supports a strong technology development and product support team with high skill sets and extensive industry experience; thus Vayo helps customers improve design quality and leverage process management in order to optimize their customers time and business.
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Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.