Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Koh Young to Showcase its Award-winning Inspection Solutions at electronica
October 19, 2022 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358.
Additionally, Koh Young is sponsoring the Advanced Packaging Conference, which event organizers are holding in conjunction with electronica. This technical conference is an important forum for discussing the latest developments in packaging technology. We look forward to meeting you at electronica 2022 and sharing our latest innovations with you.?
If you are looking for the latest in conformal coating inspection technology, you will want to check out Neptune C+ and the Neptune T at our booth. Our award-winning technology is sure to be one of the company's highlights.
Neptune C+
Most optical systems use UV light to inspect the surface for presence and gauges to measure material thickness in a particular spot, which does not provide the accuracy and repeatability needed. Inspecting transparent materials proved to be a challenge for traditional laser-confocal or electron microscope systems that only measure three-dimensional shapes. Koh Young’s revolutionary Neptune C+ delivers the ultimate solution to these challenges.
Neptune T
The Neptune T is the world's first 3D optical measurement instrument for transparent materials. It is available for coating, underfill, epoxy, glue, and bonding material inspection. With its patented L.I.F.T. technology, the Neptune T provides accurate thickness measurement of even the most transparent materials.? The system allows manufacturers to explore depths of its process and accurately identify defects with 2D, 3D, and cross-section views.
Koh Young offers a full range of inspection solutions for advanced packaging and mini- and micro-LED applications. You can learn more about these innovative systems and our multiple industry awards by visiting our booth A3.358.?
Meister D
The Meister D is a perfect solution for production-speed 3D inspection of die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chips, foreign material, and more.
Meister S
The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.
Additionally, we will present our flagship AOI (Zenith 2) and SPI (aSPIre 3) to show attendees. We offer the opportunity to discover the industry´s best performing True 3D inspection solutions.
Zenith 2
The AOI sets new standards with novel SMT process management tools by combining advanced vision algorithms with innovative high-resolution optics, allowing a wider inspection coverage including advanced tall component inspection. The Zenith 2 delivers clear and concise AOI measurement to accurately identify multiple defects such as missing solder, offset, polarity, upside down, OCV/OCR, solder fillet, billboarding, lifted lead, lifted body, tombstone, bridging, and more.
aSPIre 3
The SPI delivers the highest standard in the metrology-level True 3D SPI market, ensuring incomparable performance for the most demanding applications. The inspection system uses our AI platform for print process optimization with the award-winning Koh Young Process Optimizer (KPO).
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.