Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Building Consistent Reflow Results Across Automotive Manufacturing Sites

10/20/2026 | Miles Moreau, KIC
As automotive electronics production shifts among global locations, replicating a successful assembly process isn’t as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow performance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a difference, and why experienced engineers still play a critical role in getting the process right.

Faster BGA Warpage Processing Without Shearing or Painting

10/21/2026 | Chris Gastaldo and Neil Hubble, Akrometrix
The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™. Several years later, AI, advanced packaging, and high-performance computing are putting unprecedented demands on those interconnections

Stop Inspecting AI and Start Understanding

10/20/2026 | Sean Patterson, CrossGen AI
If you are new to a PCB shop, there is a good chance your first real job is at the back end of the line. Maybe you run the AOI station or pull boards at final inspection and flag the ones that do not pass. I want you to notice something: Every board you reject has already been built. The copper was plated and the layers pressed before you ever saw it. Your job is to catch the mistake, not to stop it from happening. That is a problem, but not with you. Unfortunately, it has always been the way most shops go about achieving quality.

The Clean Truth: The Clean Truth About No-Clean Flux

10/14/2026 | Dr. Adam Klett -- Column: The Clean Truth
One of the most misunderstood terms in electronics manufacturing is “no-clean flux.” It sounds simple enough: Use the flux, complete the soldering process, and, best of all, you don’t have to clean. Unfortunately, that interpretation has led to decades of confusion and, in some cases, preventable reliability problems.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in