Swissbit at electronica 2022
October 20, 2022 | SwissbitEstimated reading time: 2 minutes

After four years, Swissbit will be returning to electronica in Munich from November 15 to 18. The new U.3 SSD N4200, with which Swissbit has expanded into the data center market, will debut on booth 418 in hall C3. The manufacturer will also present its entire 3D-TLC memory portfolio, a range comprising interfaces and form factors suitable for all applications. As a new plug-and-play security solution option, the iShield HSM hardware security module enables maximum security for devices in AWS IoT Greengrass environments. This year, with the headline of "Talent Meets Industry", Swissbit will also be actively involved in the electronica Student Day, which will be taking place on the final day of the trade fair in hall B5. Talented young students and interested professionals will be able to discover and explore the career opportunities offered by Swissbit.
“Our first SSD designed specifically for the requirements and application profiles of data centers is the N4200, which we are presenting at the show. Thanks to its unique firmware architecture, the N4200 can be optimized for specific application profiles and realistic workloads. Compared to standard data center SSDs, it offers two- to five-times higher constant write speeds, while maintaining low latency and endurance over the course of its lifetime," explains Matthias Poppel, CSMO at Swissbit.
In addition, the new SSD has the unique ability to measure its workload during operation. Utilizing this information, Swissbit can offer an optional in-depth workload analysis and tailored firmware configuration, optimized for the demands of the respective customer application. The N4200 is available with a storage capacity of 8 TB at launch, with a 16 TB version to follow.
iShield HSM: Retrofittable security anchor for IoT devices
The iShield hardware security module (HSM) is an industrial-grade USB-A stick that enables the secure storage of cryptographic keys and credentials needed to identify and register IoT devices. The module is qualified for AWS IoT Greengrass and allows system integrators to upgrade or retrofit existing devices, such as gateways or industrial controllers, with an additional layer of security. The CC EAL6+ secure element is embedded in the hardware using chip-on-board technology.
Swissbit at the electronica Student Day
On the final day of the trade fair, young professionals will have the opportunity to learn first-hand about career opportunities at Swissbit and Hyperstone. At the "Talent Meets Industry" joint booth in Hall B5, representatives from Swissbit will be attending to present and discuss career choices as part of the Student Day on November 18. Chris Schwarze, Director of Human Resources at Swissbit, will present the Swissbit Group over two presentations, showcasing both the diverse range of career options, and Swissbit’s exciting European locations.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.