-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
BEST Installs Cold Component Removal System
October 24, 2022 | BEST, Inc.Estimated reading time: 1 minute

BEST Inc. is pleased to announce the installation of a high-precision milling center the AVX1000M from Air-Vac Engineering.
This milling system allows BEST to remove components using a cold rework process. This process capability replaces the high-temperature desoldering process with a high-precision milling process design for PCBs. This cold removal technique increases PCB rework yields as underfilled components do not have solder pushed around during the removal process thus causing soldering failures. The cold component removal is also appropriate in cases where the components to be removed are very close to heat-sensitive components or where a hot soldering iron may not be easily squeezed into tight spaces.
The AVX1000M is designed for high-end PCB rework. The milling system features precision laser measuring and alignment controls for removing the entire component to within a few thousandths of the PCB surface. The milling center also has vibration control including an integrated vacuum fixture. The machine has a built-in vacuum system to prevent debris from contaminating the PCB during the milling operation.
Dan Patten, BEST general manager stated “With this service capability BEST can now service customers requiring high volume rework of underfilled PCBs. This is going to be beneficial for automotive, consumer and military customers with handheld device using underfill.”
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.