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Koh Young Speaking on Combining DPMX with CFX will Streamline Electronics Assembly
October 25, 2022 | Koh YoungEstimated reading time: 1 minute
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss the benefits of combining IPC-DPMX with IPC-CFX to deliver data directly to machines and streamline the process. Mr. Ivan Aduna, Global MES Manager at Koh Young America, will present the whitepaper on Thursday, 03 November 2022, during the MFX5 Smart Factory & Automation Technical Session during SMTA International in Minneapolis, Minnesota.
The paper, a collaboration with Michael Ford from AEGIS Software and Hemant Shah, the IPC-DPMX Consortium Chair, will outline how to securely exchange data between design and manufacturing areas by using the Digital Product Model Exchange (IPC-2581 DPMX) and Connected Factory Exchange (IPC-2591 CFX) standards. This combination will help electronics manufacturers improve efficiency, security, and costs.
IPC-DPMX is a standard for transmitting information between a printed circuit board designer and a manufacturing or assembly facility. For nearly every step in the process, IPC-DPMX offers a standard to help companies ensure superior manufacturability, quality, reliability, and consistency. IPC-CFX is an industry-developed open standard forming the backbone of a smart factory. IPC-CFX is a plug-and-play solution that simplifies and standardizes machine-to-machine communication, while helping machine-to-business and business-to-machine applications.
Traditionally, it could take days for manufacturers to compile the necessary files needed for production. Worse, the outdated formats may exclude critical elements like stack-ups, materials, design intent, and more. With IPC-DPMX, what took days, now takes minutes thanks to an intelligent data exchange. “The IPC-DPMX and IPC-CFX combination provides production flexibility and security while driving the movement towards Industry 4.0,” said Ivan.
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
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Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/07/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Nolan’s Notes: Coming to Terms With AI
05/07/2024 | Nolan Johnson -- Column: Nolan's NotesHow fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then I went to IPC APEX EXPO and upended it all. I originally had compared AI to drag racing in that (CPU) horsepower and new (data) vehicles have steadily delivered higher performance competition. That seemed pretty accurate given how generative AI models dominated the popular media with amazing results—and sometimes spectacular crashes.