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Suggested Items

Connect the Dots: The Future of Designing for Reality—Electroless Copper

11/25/2025 | Matt Stevenson -- Column: Connect the Dots
On a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity. 

NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser

11/21/2025 | BUSINESS WIRE
NcodiN, the deep-tech startup pioneering optical interposer technology with integrated nanolasers, has secured €16 million in oversubscribed Seed financing round.

Rubin’s Cableless Architecture and ASIC High-Layer HDI Designs Push PCBs to the Center of AI Compute Power

11/20/2025 | TrendForce
TrendForce’s latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA’s Rubin platform featuring a fully cableless architecture, to hyperscalers’ in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers—they are becoming a core enabler of compute performance.

The Impact of the AI Boom on PCB and Raw Materials Supply Chains

11/13/2025 | Mark Goodwin, Ventec International Group
The PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.

Elementary, Mr. Watson: The Four Horsemen of Copper Confusion

11/12/2025 | John Watson -- Column: Elementary, Mr. Watson
If there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.
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