Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book
October 27, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes
There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.
Johnson: Matt, I understand Sunstone’s got a new eBook just ready to publish. Tell us about it.
Stevenson: You are correct. The book is called, The Printed Circuit Designer’s Guide to… Designing for Reality.
Johnson: That’s a compelling topic, and very pragmatic. Tell me about what a reader can expect to learn.
Stevenson: We envision the book as a summary: hit some of the hottest topics for design engineers to consider while designing their board from a manufacturing standpoint. Process tolerances, process variations and how that affects designs, and how designs can be done such that it doesn’t exacerbate any of the tolerances and manufacturing process windows.
Johnson: Those considerations are not always clear to somebody who’s working in design but hasn’t experienced the physical manufacture–that it is a somewhat imprecise process. You have to do some give-and-take to get the precision in manufacturing that often is required by the designer.
Stevenson: Right. There are a lot of variables in a PCB manufacturing facility. Chemical processes, mechanical processes, environmental factors, material movements. Those things can all come into play when manufacturing a circuit board.
Johnson: And if a designer can account for those considerations, that helps set things up for you to deliver greater yield and precision?
Stevenson: Exactly. I always like to tell new designers to come visit a circuit board shop so you can see firsthand some of those real-life applications of chemical and physical processes, how there are limitations, and how design can make the results worse or less manufacturable, and also, less reliable down the road. In the book, we really try to give you all the tips and tricks for highest-yield designs and highest-reliability design.
Johnson: Give me a couple of examples of things to consider from the book.
Stevenson: One of the most critical is fluid movement within a through-via: trying to get the electroless copper in and out of a via with sufficient timing to get the thickness so that you get a good metallization throughout the hole. The thicker the panel, the smaller the hole, the harder it becomes from a physics standpoint to get plating solution to move uniformly through the via. You’re relying more on capillary action rather than actual fluid movement.
Johnson: That’s a great example because, in the design tool, the designer is looking at that as a perfect cylinder, right? Designers see it as a perfect hollow cylinder through the board, but the reality?
Stevenson: It’s never perfect. Think of it as rifling from the drill bit. There’s a lot of topography inside that hole between glass and epoxy, lots of different types of materials inside that hole. It definitely is not smooth. It almost acts like Velcro for air bubbles inside that hole.
Johnson: Considerations such as this are what you’re bringing to the forefront in your book?
Stevenson: Yes! We try and give as many tips as we can.
Johnson: Who do you see as the ideal target reader?
Stevenson: The beginner and new PCB designers will get the most from it, but even seasoned designers will find “ah-ha” moments.
Johnson: Sounds like think this will be a great resource for any designer looking to make the best decisions to save time and money.
Stevenson: It’s something that we’ve been passionate about for a long. Our hope is that it is well received, and we can do a follow-up.
Johnson: Terrific. Matt, thanks for taking the time to talk.
Stevenson: Thank you, Nolan.
To download The Printed Circuit Designer’s Guide to… Designing for Reality, click here.
To visit the I-007 eBooks Library, click here.
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.