Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
Revolutionizing Radar Signal Processing
November 1, 2022 | DARPAEstimated reading time: 1 minute
Radar systems have seen many technology improvements in apertures (antennas) and associated hardware and software since the nascent operational versions in World War II. What hasn’t changed significantly over the decades, however, is that radars still use linear signal processing between the aperture and the detector. In the 1940s linear radar signal processing used vacuum tubes and analog circuits, while current radars accomplish linear signal processing digitally with microchips and software.
With the Beyond Linear Processing (BLiP) program, DARPA’s goal is to improve radar performance by applying innovative signal processing methods. BLiP will leverage high-power computer processing to explore new, non-linear and iterative signal processing techniques that could lead to lighter, smaller, and less expensive – but equally capable – radar systems. If successful, BLiP would enable the same radar performance achieved on large platforms today on much smaller sea, air, and ground platforms.
“A lot of radar improvements over the past 30 years have focused on growing the size of the aperture for greater sensitivity or increasing transmitter power,” said Frank Robey, BLiP program manager in DARPA’s Strategic Technology Office. “Those are important, but if we want to shrink aperture size by 50% and still get the same radar performance then we need to disrupt the linear signal processing paradigm. With the tremendous increases in computer processing power available today, we can take a fresh look at radar signal processing and explore iterative, leap-ahead techniques.”
BLiP will address the current immaturity of non-linear and iterative signal processing methods. Over the course of the two-year program, end-to-end radar signal processing chains will be developed, analyzed, implemented and tested – initially through non-real-time laboratory testing and culminating in real-time implementation and full-scale field testing using an operational National Weather Service radar. Key technical challenges for BLiP will be the development, understanding, and optimization of the signal processing chain, and the practical aspects of implementing BLiP algorithms using real-time, high-performance processing.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory
08/08/2025 | PRNewswireMacronix International Co., Ltd., a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a single device, the essential performance and an array of security features that deliver rapid boot times and iron-clad data protection.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.