-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
June 6, 2025 | BUSINESS WIREEstimated reading time: 2 minutes
Keysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications. Building on TSMC’s Analog Design Migration (ADM) methodology, the new RF design migration workflow integrates RF solutions from Keysight and the AI-powered RF migration solution from Synopsys to streamline the redesign of passive devices and design components to TSMC’s more advanced RF process rules.
RF circuit designers can now use AI technologies for RF design migration with TSMC’s ADM methodology. Beyond the productivity gains offered by ADM, the Keysight and Synopsys migration workflow leverages the performance gain of the N4P process for the LNA design migrated from N6RF+. Key components of the design migration flow include the Synopsys Custom Compiler™ layout environment with Synopsys ASO.ai™ for rapid analog and RF design migration, Synopsys PrimeSim™ circuit simulator, and Keysight RFPro for device parameterization, automated value fitting, and electromagnetic (EM) simulation.
AI enables and aids RF circuit designers in a novel way to rapidly achieve the migration process and redesign to the N4P process, resulting in faster time-to-market. Synopsys Custom Compiler, along with ASO.ai, an AI-driven analog design migration solution, identifies optimal design parameters to meet performance metrics. Keysight RFPro enables parameterization of passive devices, including inductors, and automatically re-creates simulation models with layouts tuned to the new process rules.
Sanjay Bali, Senior Vice President of Strategy and Product Management at Synopsys, said: “Analog design migration is a challenging and time-intensive process requiring significant trial and error. Our deep collaboration with Keysight Technologies and TSMC enables design teams to boost their productivity with an AI-powered RF design migration flow to accelerate the redesign process and deliver RF designs more efficiently, while achieving the best PPA (Power, Performance, and Area) on TSMC’s advanced nodes.”
Niels Faché, Senior Vice President of Keysight’s Design Engineering Software, said: “Meeting PPA requirements while adhering to new process design rules is one of the biggest challenges facing complex RF chip designs. RF circuit designers want to leverage and reuse their libraries of N6RF+ devices and component intellectual property to improve ROI. The deployment of Synopsys ASO.ai for efficient analog design migration and Keysight RFPro for passive device modeling within TSMC’s ADM methodology facilitates accelerated redesign in the advanced TSMC N4P technology for existing components originally built in N6RF+. No time-consuming data handoffs or domain specialization are required, which increases overall engineering productivity for RF circuit designers.”
Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC said: “We offer a powerful combination of advanced logic and mixed signal/radio frequency (MS/RF) technologies, enabling our customers to design differentiated wireless connectivity products. Through collaboration with our Open Innovation Platform® (OIP) design ecosystem partners such as Keysight and Synopsys, we’re delighted to deliver a highly efficient RF design migration flow. This enables our customers to quickly transition their designs to more advanced processes, maximizing performance and power efficiency benefits while accelerating time-to-market.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
The Art and Science of PCB Floor Planning: A Comprehensive Guide
08/14/2025 | Cory Grunwald and Jeff Reinhold, Monsoon SolutionsPCB design is an intricate and crucial part of developing electronic products. One of the foundational stages of PCB design is floor planning, a phase where the placement of components and the flow of signals are meticulously mapped out. A good floor plan ensures that the PCB performs well, is easy to manufacture, and meets all mechanical and electrical requirements. We’ll explore the essential aspects of floor planning, from its objectives and process to the challenges that designers face.
EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary
08/12/2025 | EnSilicaThe facility strengthens EnSilica’s presence in the European Union and taps into Budapest’s deep technology ecosystem, which hosts numerous leading automotive and industrial multinationals. This expansion will increase the Group’s global headcount to around 210 employees.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
08/13/2025 | John Watson -- Column: Elementary, Mr. WatsonIn November 2022, I wrote a column called "Is Your Bathroom in the Kitchen?" This piece related a bizarre real estate listing that emerged out of St. Louis that had architects scratching their heads and interior designers cringing. Nestled in the historic Central West End sat a 200-square-foot apartment that completely defied logic. It wasn't the size that raised eyebrows, it was the layout. Here's the kicker: While that's rare in real estate, it's shockingly common in PCB design.