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Isola Brings Broad Range of Circuit Material Solutions to Electronica 2022
November 2, 2022 | Isola GroupEstimated reading time: 2 minutes
Isola Group is coming to Munich, Germany and Electronica 2022 with an assortment of circuit materials expected to meet or exceed the needs of the broad range of markets the international event serves. Set for November 15-18, 2022 in the Trade Fair Center, Messe Munchen, Electronica 2022 is the world’s leading conference and exhibition for the design and production of all things electronic, from consumer products to long-lasting assemblies built for space. Isola Group will be in Hall B1, Booth #422 at the show. Isola’s material experts will welcome visitors with advice and guidance on optimum use of the company’s most popular laminates and prepregs.
Like Electronica 2022, Isola’s circuit materials cover a broad spectrum of markets, for printed circuit boards (PCBs) in everything from portable electronic devices and automotive safety systems to Fifth Generation (5G) base stations and small cells and satellite communications (satcom) systems. The materials are “made for manufacturing,” formulated with characteristics that enable different circuit materials to be fabricated with compatible processes, even when they are used to form multilayer, multiple-signal PCBs with a blend of analog, digital, and power circuitry. Isola’s materials on display will include I-Tera® MT40, I-Tera® MT40 (RF/MW), Astra® MT77, Tachyon® 100G, TerraGreen®, TerraGreen® (RF/MW), and TerraGreen® 400G.
These high-performance circuit materials feature key parameters, such as high glass transition temperature (Tg) and decomposition temperature (Td) to encourage compatibility of processing. The materials offer circuit designers and PCB fabricators a wide choice of circuit performance parameters, including permittivity (Dk) and dissipation factor or loss (Df), with behavior that remains stable over wide operating temperature ranges, making them suitable choices for many growing electronic applications including Advanced Driver Assistance Systems (ADAS) and their 77 GHz mmWave radar circuits, 5G wireless communications networks, and smart energy systems.
I-Tera MT40, which is a good starting point for many high-speed digital (HSD) circuits and RF/microwave PCBs, is RoHS, lead-free process compatible and FR-4 process compatible. With a Dk that is stable with frequency (3.45 through 10 GHz) and over wide temperature ranges, it forms reliable PCBs for HSD and also microwave applications. For higher microwave frequencies, I-Tera MT-40 (RF/MW) offers Dk tailored to a user’s requirements but boasts performance consistent with time, temperature, and frequency, which is true for the general-purpose/HSD versions of the material as well.
When circuit loss is a concern, few circuit materials can match the performance of Isola’s Astra MT77 laminates (also available as prepregs without copper cladding) and their low Df of 0.0017. Also, FR-4 process compatible, these materials are ideal candidates for the mmWave portions of 5G networks and the 77 GHz radar circuits in ADAS systems. For mmWave frequency coverage where low z-axis (thickness) coefficient of thermal expansion (CTE) is required, Isola’s Tachyon 100G provide extremely high stability over frequency and temperature through 100 GHz analog frequencies and 100 Gb/s digital rates. And for designers and PCB producers in need of high-performance, halogen-free circuit materials, Isola’s TerraGreen, TerraGreen (RF/MW), and TerraGreen 400G provide lead-free RoHS-compliant solutions usable for PCBs operating through high microwave frequencies and high-speed digital rates. Visitors to Electronica 2022 are welcome to visit Booth #422 to learn more.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.