-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
KLA Corporation Announces Robert Calderoni as New Chair of the Board
November 4, 2022 | KLAEstimated reading time: 1 minute
KLA Corporation announced that its Board of Directors has appointed Robert Calderoni as chair effective immediately. Calderoni will succeed Edward "Ned" Barnholt whose term has ended, having served as Board Chair since 2006.
Calderoni has held a seat on the KLA Board as an independent director since 2007. A highly respected leader, he has more than 30 years of executive experience in the technology industry. Calderoni was most recently the interim president and chief executive officer at Citrix Systems prior to its acquisition in September 2022. Previous roles have included chief executive officer at Ariba, Inc., president of SAP AG's cloud business, and chief financial officer of Avery Dennison. Earlier in his career, he held senior financial roles at Apple and IBM.
"I feel extremely privileged to take on this role and contribute to shaping KLA's future," said Calderoni. "I look forward to continuing to work alongside fellow Board members and the executive team to support and drive KLA's long-standing leadership in the global semiconductor and electronics manufacturing industry and help continue to deliver sustainable profitability and long-term value to stakeholders."
"We are thrilled that Bob is stepping in to lead KLA's Board of Directors," said Rick Wallace, president and CEO of KLA Corporation. "A highly regarded corporate leader with global operational perspective, Bob's deep understanding of the technology ecosystem has been invaluable during his tenure as a KLA board member and will be instrumental in advancing our strategic goals."
"On behalf of the management team and employees, I want to thank Ned for his leadership as chair," said Wallace. "Ned has led this Board and executive management team through challenging times to record revenue and profits, and he leaves us with a strong foundation for continued growth."
Suggested Items
SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
01/07/2025 | PRNewswireSparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®
Amar Maletira Appointed to Celestica’s Board of Directors
01/07/2025 | CelesticaCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.