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SMTA UHDI Symposium: Shortening the Learning Curve

01/15/2025 | Marcy LaRont, I-Connect007
SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.

Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly

01/14/2025 | Happy Holden -- Column: Happy’s Tech Talk
Dr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment

01/07/2025 | PRNewswire
SparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®

Amar Maletira Appointed to Celestica’s Board of Directors

01/07/2025 | Celestica
Celestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.
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