Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Altus Enhances 3D AOI Inspection at Leading CEM
November 11, 2022 | Altus GroupEstimated reading time: 1 minute
Working closely with Altus Group, Sellectronics, a leading contract electronics manufacturer specializing in quick turn-around prototype assembly and low volume/high mix production, has recently invested in Koh Young’s 3D AOI inspection equipment to further enhance production.
Recognized for its innovative, high-quality PCB assembly, Sellectronics continually invest in leading-edge technology to provide assembly excellence. Looking for the equipment that would enable precise inspection, and best performance-to-price ratio to increase quality further and improve production times, the company approached Altus for guidance.
Jason O’Connell, Sellectronics Technical Director, said: “As the business grows, the company makes many investments in the latest equipment to improve processes and ensure we are capable of providing the most intricate PCB assembly service with the best possible accuracy.”
To help increase inspection precision, Altus recommended the Zenith Alpha HS+ from Koh Young. As a true 3D AOI solution, it is powered by artificial intelligence and machine learning, combining the best optomechatronics and vision technologies to deliver outstanding performance without sacrificing accuracy.
Suitable for demanding production lines like those in Sellectrionics, Zenith Alpha HS+ greatly improves process yields by removing the need for manual inspection. In addition, the technology incorporates AI to deliver the accuracy required for ultra-fine pitch and solder joint interreflection challenges to enhance production. It also features KSMART, a measurement-based process analysis solution that allows for Industry 4.0 implementation with reliable full 3D measurement data.
Graham Tonkin, Sellectronics Director of Sales and Marketing, said: “Due to the precise and quantifiable measurement of the Koh Young platform, and by exploiting KSMART statistical process capability, our engineering process improvement and quality teams can aggregate real-time production information. This not only removes the chances of an escape, but also to study our production processes in detail to improve our yields and drive our quality standards ever higher.”
Joe Booth, Altus Group CEO, concluded: “We are delighted to implement another Alpha HS+ system into the field and establish another new Koh Young user as the momentum of the new these innovative platforms keeps building. This equipment addition is just one of the investments that Sellectronics has made as they continue to deliver top quality electronics manufacturing.”
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.