Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Altus Enhances 3D AOI Inspection at Leading CEM
November 11, 2022 | Altus GroupEstimated reading time: 1 minute
Working closely with Altus Group, Sellectronics, a leading contract electronics manufacturer specializing in quick turn-around prototype assembly and low volume/high mix production, has recently invested in Koh Young’s 3D AOI inspection equipment to further enhance production.
Recognized for its innovative, high-quality PCB assembly, Sellectronics continually invest in leading-edge technology to provide assembly excellence. Looking for the equipment that would enable precise inspection, and best performance-to-price ratio to increase quality further and improve production times, the company approached Altus for guidance.
Jason O’Connell, Sellectronics Technical Director, said: “As the business grows, the company makes many investments in the latest equipment to improve processes and ensure we are capable of providing the most intricate PCB assembly service with the best possible accuracy.”
To help increase inspection precision, Altus recommended the Zenith Alpha HS+ from Koh Young. As a true 3D AOI solution, it is powered by artificial intelligence and machine learning, combining the best optomechatronics and vision technologies to deliver outstanding performance without sacrificing accuracy.
Suitable for demanding production lines like those in Sellectrionics, Zenith Alpha HS+ greatly improves process yields by removing the need for manual inspection. In addition, the technology incorporates AI to deliver the accuracy required for ultra-fine pitch and solder joint interreflection challenges to enhance production. It also features KSMART, a measurement-based process analysis solution that allows for Industry 4.0 implementation with reliable full 3D measurement data.
Graham Tonkin, Sellectronics Director of Sales and Marketing, said: “Due to the precise and quantifiable measurement of the Koh Young platform, and by exploiting KSMART statistical process capability, our engineering process improvement and quality teams can aggregate real-time production information. This not only removes the chances of an escape, but also to study our production processes in detail to improve our yields and drive our quality standards ever higher.”
Joe Booth, Altus Group CEO, concluded: “We are delighted to implement another Alpha HS+ system into the field and establish another new Koh Young user as the momentum of the new these innovative platforms keeps building. This equipment addition is just one of the investments that Sellectronics has made as they continue to deliver top quality electronics manufacturing.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.