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IEC Announces Sale of ModVIA Expandable Plasma System from Nordson Electronics Solutions
November 22, 2022 | IECEstimated reading time: 1 minute
Multicircuits, located in Oshkosh, WI, a small and large quantity and high quality circuit board manufacturer, along with IEC, are pleased to announce the purchase of a brand new ModVIA Expandable Plasma System from Nordson Electronics Solutions.
The ModVIA Expandable Plasma System combines the best in class technology of the VIA Series while retaining the PCB Series size and function. Using MARCH’s High Flux Electrode design, the ModVIA system is capable of uniform plasma treatment for PCB panels, as well as desmear and etchback, and can process rigid and flexible panels.
Nordson Electronics Solutions – For over 30 years Nordson Electronics Solutions has been the global leader in plasma cleaning and plasma surface treatment equipment, and plasma applications technology. Known as Nordson MARCH since 2009, the organization has broad experience advanced semiconductor packaging and assembly, wafer level packaging, printed circuit board manufacturing, life science and medical device assembly, and various large-scale industrial applications.
International Electronic Components (IEC) – IEC is the longest serving distributor of consumables, equipment, and services in the North American printed circuit board industry for over 50 years. IEC has established themselves as a dependable, responsive organization with locations in Toronto, Canada, Santa Clara, CA, Chicago, IL, Norristown, PA, and our brand new location in Laguna Hills, CA. IEC works closely with its suppliers and customers in order to provide best-in-class service across North America.
Multicircuits Inc. – Since 1990, Multicircuits Inc. has been committed to providing high quality PCB backed with superior customer service. Offering prototyping, fast turnaround, and full production runs of single-sided to multi-layer boards and capable of low and high output, Multicircuits is capable of supplying PCB needs for nearly any application.
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