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My Experience With Maxwell
November 23, 2022 | Happy Holden, I-Connect007Estimated reading time: Less than a minute

I was first introduced to James Maxwell in 1967 as a college student. I had to decide whether I would take the Maxwell fields course or the switching and coding course. Being a chemical engineering major with a co-major in control theory, I had heard about the trials and tribulations of the infamous Maxwell fields course.
After a lot of consideration, I decided to take the switching and coding course, since it was more related to computer theory, while the fields course was more related to RF, power generation/distribution, and communications.
In those days, our transistors, tubes and ICs were still pretty slow, except for radio, radar, etc. At that time, signal integrity in board layout was not an issue. I was using RTL, DTL and slow TTL logic on breadboards of non-plated through-holes with tinned-copper wire and Teflon spaghetti tubing.
But after talking with students who had managed to successfully pass the fields course, I was awed by the mathematical rigors they had endured. I was astounded when these very same students found thermodynamics so difficult. Maxwell’s eqations are not easy.
To read this entire article, which appeared in the November issue of Design007 Magazine, click here.
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
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Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
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Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
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