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ZESTRON Launches New Product - VIGON SC 200 Stencil Cleaner Wipes
November 30, 2022 | ZESTRONEstimated reading time: Less than a minute

ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce a new product to the market, VIGON® SC 200 Stencil Cleaner Wipes. A powerful combination of low-lint wiping material and effective stencil chemistry provides an efficient and safe alternative to alcohol-based cleaners.
VIGON® SC 200 Stencil Cleaner Wipes are designed to manually remove solder pastes and adhesives in electronic assembly manufacturing. Due to the water-based chemistry formulation, they provide exceptional cleanliness while ensuring operator safety. The polyester non-woven wipes offer excellent wet strength, reduce staining and lint left behind on your stencil, as well as increase cleaning protocol consistency. Compatible with nano-coated stencils, they are an ideal replacement for alcohol-based cleaners and are recommended for use in both manual and prior to automatic cleaning processes.
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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.