Omnitron Sensors Solves Reliability, Size, Cost Issues with LiDARs
December 1, 2022 | PRNewswireEstimated reading time: 2 minutes
Omnitron Sensors, the pioneer in MEMS sensing technology for high-volume, low-cost markets, validated its process for a fast, rugged, low-cost microelectromechanical systems (MEMS) scanning mirror, a new optical subsystem that meets the most demanding requirements of the LiDARs used in automotive advanced driver assistance systems (ADAS), drones and robotics.
Targeting a LiDAR subsystems market predicted by Yole Intelligence to reach $2.3B by 2026[i], Omnitron's MEMS mirror will produce a 2-3X larger field of view than other MEMS mirrors used in long-range LiDARs. As a step-scanning mirror, Omnitron's device is designed for rugged high-vibration automotive and aerial environments—a competitive advantage over the spinning mirrors offered by other vendors. In addition, Omnitron's MEMS mirror is built to outperform older optical subsystems, including voice coils, spinning polygons, and Galvos—all of which are slower, bulkier, 10x-100x more expensive, and prone to failure.
"Our executive team has spent decades in sensor design, working on projects at Google (X) Wing avionics, Google Quantum, Tesla Model 3, US Navy Research Labs, and Lumedyne—which Google acquired during my tenure," said Eric Aguilar, co-founder and CEO, Omnitron Sensors. "With so much untapped potential in MEMS sensors still before us, we saw how changing the process technology and packaging techniques—which we call a new topology for MEMS—produces measurable improvements in size, cost, robustness, reliability, manufacturability and time to market. Our MEMS scanning mirror for LiDARs proves out our IP, solving the most serious issues that plague today's LiDARs for autonomous navigation. And based on the positive market reception we have received, we're meeting a vital need for long-lasting, high-performing, rugged and cost-effective LiDAR platforms."
With its MEMS process verified through fabrication, Omnitron Sensors is gaining the attention of investors. In Q4 2021, L'ATTITUDE Ventures invested $1.6M in seed-round funding to Omnitron and named the company L'ATTITUDE Latino Startup of the Year.
"I've spent 20 years in the wireless chip and sensors space, so I recognize an impressive technology when I see it," said Sol Trujillo, general partner of L'ATTITUDE Ventures, an investment firm noted for its steadfast support of talented Latino/Latina entrepreneurs. "Omnitron's starting point—the delivery of a step-scanning mirror with the potential to transform LiDARs for autonomous cars, drones, and mobile devices—is definitely impressive.
"Shaped by Eric Aguilar's vision and technical acumen, Omnitron's foundational IP in MEMS also has the potential to become a key enabler of robust and reliable smart-everything devices. These varied attributes illustrate why L'ATTITUDE believes in Omnitron's growth potential."
Solving MEMS manufacturing challenges
Manufacturing MEMS devices is notoriously difficult. Problems with size, reliability, durability and repeatability—and the fact that process technology is unique for each new MEMS device—make MEMS manufacturing expensive and slow design-to-delivery cycles. Omnitron's core IP solves these challenges. As a new topology for MEMS, Omnitron's IP rearranges manufacturing processes and supports them with new packaging techniques. This speeds volume production of a wide range of small, low-cost, precise MEMS sensors—from scanning mirrors and inertial measurement units (IMUs) to microphones, pressure sensors, and telecom switches—through established MEMS foundries.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).