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Suggested Items

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS

04/15/2026 | Indium Corporation
Indium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.

AI Compute Demand Drives 44% YoY Growth for Top 10 Global Fabless IC Firms in 2025

04/01/2026 | TrendForce
Continued investment in AI infrastructure by major CSPs, including purchases of GPUs and deployment of in-house ASICs, has driven strong growth among AI-related chip designers, according to TrendForce’s latest findings.

Molex Boosts AI Clusters with Optical Interconnects

03/19/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.

CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics

03/11/2026 | NcodiN
CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
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