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Suggested Items

Advanced Packaging-to-Board-Level Integration: Needs and Challenges

09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics Association
HPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.

Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer

09/09/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO). 

New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

08/26/2025 | I-Connect007
In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.

Amphenol to Acquire Connectivity and Cable Solutions Business From CommScope

08/04/2025 | BUSINESS WIRE
Amphenol Corporation announced a definitive agreement to acquire CommScope’s Connectivity and Cable Solutions (CCS) business for $10.5 billion in cash, subject to customary post-closing adjustments.

New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI

07/28/2025 | I-Connect007
The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
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