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Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology

06/26/2024 | ANSYS
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.

Scanfil Helps with KIS Evo Booth Visualization

06/26/2024 | Scanfil
Together with KIS (part of the ME Group), one of Scanfil’s key customers in Myslowice Poland, we wanted to bring the product to life and show how complex a photo booth can be.

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

06/26/2024 | Cadence Design Systems, Inc.
The Cadence Janus NoC manages these simultaneous high-speed communications efficiently with minimal latency, enabling customers to achieve their PPA targets faster and with lower risk.

Siemens, Intel Foundry Collaborate to Deliver New Tools Certifications and EMIB/3D-IC Innovation

06/25/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.

Schweizer, Zollner Announce Strategic Partnership in the Field of Power Embedding

06/25/2024 | Schweizer Electronic AG
To achieve a CO2-neutral world and an All-Electric Society, where electricity is the primary energy source, innovations like high power densities, reduced losses and system cost advantages are essential.
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