Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
E-Mobility a Driver of Topics at IPC APEX EXPO
December 9, 2022 | Sandy Gentry, IPCEstimated reading time: 1 minute
E-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e-Mobility presents new challenges that the electronics supply chain is working together to resolve.
You can find the latest information on e-Mobility at several technical sessions at IPC APEX EXPO 2023.
The IPC APEX EXPO Technical Conference will host an engaging special session focused on e-Mobility touching on supply chain and technology issues. The e-Mobility Special Session includes speakers and panelists from Rivian. Overall, the technical conference offers many technical papers advising on assembly and design for high reliability. A few highlights include
- S02: EX 1- High Reliability for Extreme Environments 1 including a paper by Dr. Walter Olbrich, TTM Technologies, titled “Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness”
- S06: EX 2- High Reliability for Extreme Environments 2 with a presentation from Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
- S23 EM3-C&C Electronic Materials Cleaning and Coating 1 including a paper from Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH on “Investigation of the Electrochemical Reliability of Conformal Coatings under High Voltage
- S25: QRTI-Assembly Risk Prediction and Failure Analysis including a paper, “Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation,” by Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
IPC standards development task groups will be diligently working to advance manufacturing and design standards in the areas of high voltage. The test methods task group will celebrate the release of the new test method for high voltage testing. Task groups of interest are the 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum, 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group, D-33AA: IPC-6012 Automotive Addendum, or 5-21M: Cold Joining/Press-fit Task Group.
Professional Development Workshops take place on Sunday, January 22, and Monday, January 23, including PD28: Press-fit Technology - Value Chain, Physics, Process and Standards which provides insight into the production, design, and application of compliant press-fit pins and components as well as new materials and surface finish technologies.
In addition, of interest to those electrifying and advancing systems within vehicles, IPC is hosting an E-Textiles Conference, collocated with IPC APEX EXPO on Sunday January 22.
Share on:
Suggested Items
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
11/15/2024 | Keysight TechnologiesKeysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).
Neways Partners with MilDef for the Production of Advanced Electronic Components
11/15/2024 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, announces it has entered into a partnership with MilDef, the developer of world-leading tactical IT solutions, products and systems, made to perform in the toughest conditions.