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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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E-Mobility a Driver of Topics at IPC APEX EXPO
December 9, 2022 | Sandy Gentry, IPCEstimated reading time: 1 minute
E-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e-Mobility presents new challenges that the electronics supply chain is working together to resolve.
You can find the latest information on e-Mobility at several technical sessions at IPC APEX EXPO 2023.
The IPC APEX EXPO Technical Conference will host an engaging special session focused on e-Mobility touching on supply chain and technology issues. The e-Mobility Special Session includes speakers and panelists from Rivian. Overall, the technical conference offers many technical papers advising on assembly and design for high reliability. A few highlights include
- S02: EX 1- High Reliability for Extreme Environments 1 including a paper by Dr. Walter Olbrich, TTM Technologies, titled “Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness”
- S06: EX 2- High Reliability for Extreme Environments 2 with a presentation from Kennedy Fox, Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
- S23 EM3-C&C Electronic Materials Cleaning and Coating 1 including a paper from Dr. Heiko Elsinger, Senior Expert, Robert Bosch GmbH on “Investigation of the Electrochemical Reliability of Conformal Coatings under High Voltage
- S25: QRTI-Assembly Risk Prediction and Failure Analysis including a paper, “Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation,” by Eric Campbell, Advisory Hardware Development Engineer, IBM Corporation
IPC standards development task groups will be diligently working to advance manufacturing and design standards in the areas of high voltage. The test methods task group will celebrate the release of the new test method for high voltage testing. Task groups of interest are the 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum, 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group, D-33AA: IPC-6012 Automotive Addendum, or 5-21M: Cold Joining/Press-fit Task Group.
Professional Development Workshops take place on Sunday, January 22, and Monday, January 23, including PD28: Press-fit Technology - Value Chain, Physics, Process and Standards which provides insight into the production, design, and application of compliant press-fit pins and components as well as new materials and surface finish technologies.
In addition, of interest to those electrifying and advancing systems within vehicles, IPC is hosting an E-Textiles Conference, collocated with IPC APEX EXPO on Sunday January 22.
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Brent Fischthal - Koh YoungSuggested Items
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