-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC Winter Conference Lyon, France 2023 Calls for Registration
December 9, 2022 | EIPCEstimated reading time: 1 minute

France is evocative of many things, amongst them some classics: their cuisine, their architecture, their music. In the latter category, who has not heard the timeless “Songs from the Auvergne” by Joseph Canteloube. Who has not been to Lyon, in the Auvergne Region?
If you wish to part of another classic event, then please consider joining the EIPC Winter Conference which is to be held over two days the first in the famous Grouparna Football Stadium in Lyon, wherein The Kopster Hotel will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day we shall be dining, rather well, downtown Lyon centre.
The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, ASS Luippold, Dyconex, Suss MicroTec, Showa Denko, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Taiyo and Parachem.
In announcing this now we are mindful of the need to complete our registration by 6th January, as we are restricted to only 96 delegates for the visit to the Bugey Nuclear Power Plant. So please come and join us at what will be another memorable EIPC Conference, and Lyon in the winter is sublime. As for the gastronomy, we will find out!
- Deadline Registration Power Plant visit: January 6, 2023
- Max. number of visitors Power plant: 96
- Please be aware that Conference Day 2 including visit ends at 16.00 hrs on Feb 10.
- We need to receive a copy of the passport of all visitors to the Bugey Nuclear Power Plant before Jan 6, 2023
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.